AI & HPC Ready

Liquid-cooled modular infrastructure for high-density computing.

The AI & HPC Ready model is designed for next-generation workloads requiring higher power density, advanced cooling, and scalable performance. Using liquid cooling directly at server level, this solution enables power capacities of up to 60 kW per rack, making it ideal for AI clusters, GPU infrastructure, machine learning, and high-performance computing environments. Available in 20 ft and 40 ft configurations, the model features an extended width up to 3.2 meters to provide the space required for high-density equipment, cooling distribution, and service access. Due to its larger format, transport requires an oversized / out-of-gauge transportation procedure.