Solution
AI & HPC Ready
High-density compute for AI and HPC workloads.
Deploy infrastructure optimized for GPU clusters, machine learning pipelines, and high-performance computing. Our AI & HPC Ready platform provides the power density, precision cooling, and low-latency networking that AI scale demands.
Technical Specifications
Technical Data
Cooling Type
Liquid / Direct-to-Chip
Power Density
Up to 100 kW/rack
Network
400G InfiniBand
PUE
< 1.2
GPU Support
NVIDIA H100 / A100
Deployment Time
6–12 weeks
Storage
NVMe / Parallel FS
Availability
99.999% (Tier IV)
Management
AI-optimized DCIM
(*) Limited up to 300KW stand alone version or up to 1200KW only in combination with separate Power, Cooling Skids and/or Modules
For complete technical data,
contact our engineering team.
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Ready to deploy AI & HPC Ready?
Our engineering team is ready to design the perfect infrastructure for your requirements.